VIA-developed Pico-ITXe Claims Center Stage at Computex 2009

SEOUL, Korea (AVING) — <Visual News> VIA Technologies today announced the recently launched Pico-ITXe form factor received the coveted ‘Best of Computex’ award by the Taiwan Computer Association and the Taiwan External Trade Council (TAITRA), during a ceremony today.

Developed in collaboration with the Small Form Factor Special Interest Group (SFF-SIG), the Pico-ITXe form factor utilizes SUMITTM connectors for additional modular I/O, offering developers more flexible and cost-effective design options for compact embedded systems. The Pico-ITXe specification means that designing next generation embedded devices is as simple, expedient and rational as possible.

“VIA has continually sought to deliver ground-breaking form factor designs that make compact, flexible system design easier than ever before,” said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. “Pico-ITXe has helped transform the small form factor landscape, with many key industry players producing compatible Pico-IO modules.”