[LED EXPO&OLED EXPO 2011] Protec to Present its LED Die Bonding System

SEOUL, Korea (AVING Special Report on ‘LED EXPO&OLED EXPO 2011’) — <Visual News> Protec(www.protec21.co.kr) will introduce its LED Die Bonding System at the ‘LED EXPO&OLED EXPO 2011’ which will be held at KINTEX, Ilsan on June 21~24.

Protec announced LED Die bonder which has high accuracy and speed than competitors and it will provide best performance to the customer.

LED Die Bonding system features 4-spindle Rotary stamp head, 180msec bonding cycle time, compact design and maintenance free design and full touch screen user interface.

Protec established in 1993 is professional automation equipment maker. It focuses advanced automation of LED, semiconductor and SMT/PCBA packaging field and innovated and provided unique technology to the same industry.

Especially, it is a frontier in high precision dispensing technology in the world leading the highest level of technology in this field. It has been continuing to develop innovative technology.