Fibocom, an IoT wireless solution maker, has joined forces with STMicroelectronics, a semiconductor manufacturer, to unveil an advanced smart home solution at the Mobile World Congress (MWC) Barcelona 2024. Leveraging Matter-compatible technologies, namely the STM32WB55 and FG370, two companies promised this solution seamlessly centralizes control of smart home devices, overcoming protocol barriers and ensuring smooth interaction.

Two companies said connecting devices from different manufacturers without protocol barriers remains a significant challenge in today's smart home landscape. The Connectivity Standards Alliance ensures interoperability while adopting 5G Fixed Wireless Access (FWA) devices to enhance in-home connectivity with flexibility and reliability.

Fibocom and STMicroelectronics have integrated the smart home solution into a 5G Customer Premises Equipment (CPE) using ST's MCU STM32WB55 and Fibocom's 5G module FG370. The STM32WB55 supports Bluetooth/Thread/Zigbee technologies, facilitating seamless bridging of smart home devices and interconnections at the application layer. With FG370 enabling 5G communication, the STM32WB55 docks onto the CPE, enhancing control and automation without redundant setups.

Yin Yu, Marketing Manager at STMicroelectronics, emphasized ST's commitment to IoT connectivity solutions and highlighted the integration of STM32WB55 into Fibocom's 5G FG370 module, enabling seamless smart home ecosystems on 5G CPE.

Chris LaPré, Head of Technology at Connectivity Standards Alliance, acknowledged the collaboration's contribution to simplified, secure, and seamless interconnection, facilitating a connected future through Matter-compatible smart home solutions.

Simon Tao, VP of MBB BU at Fibocom, expressed the company's commitment to superior in-home connectivity and highlighted the potential of 5G FWA devices as central hubs. He emphasized the partnership's role in accelerating smart home solutions on a unified platform.